TAIPEI, TAIWAN - SEPTEMBER 02: Visitors converse beside a poster detailing Glass Through-Vial (TGV) wafer and panel packaging technology during SEMICON Taiwan 2026 at the Taipei Nangang Exhibition Center on September 02, 2026 in Taipei, Taiwan. SEMICON brings together the world's biggest semiconductor manufacturers for a display of the latest developments, as AI accelerates demand for chips. (Photo by Cheng Chia Huang/Getty Images)